MosChip Technologies, a leading provider of silicon and product engineering services, has announced its collaboration with EMASS to support the silicon implementation of the company’s ultra-low-power ECS-DoT Edge AI System-on-Chip (SoC). The ECS-DoT is engineered to deliver always-on intelligence for wearables, drones, industrial IoT devices, and edge sensors.
EMASS spearheaded the architecture design of the ECS-DoT, setting ambitious goals for performance and energy efficiency—targeting up to 93% faster processing and 90% lower power consumption compared to traditional edge AI solutions. MosChip contributed by delivering end-to-end engineering services for the 22nm silicon implementation, including physical design flows, tape-out coordination, packaging, assembly, evaluation hardware, and validation. This collaboration resulted in a fully functional SoC and evaluation platform.
“This collaboration highlights the value of combining innovative SoC architecture with expert silicon engineering,” said Srinivasa Rao Kakumanu, CEO & Managing Director of MosChip Technologies. “EMASS developed a highly differentiated architecture, and we were pleased to support its realization through our physical design and product engineering capabilities.”