izmo Ltd. on Monday announced a key technological milestone, with its specialised division izmo Microsystems successfully designing a high-complexity 3D System-in-Package (SiP) module for space payload camera electronics.
The newly developed module uses an advanced 3D SiP architecture with stacked substrates, meeting stringent reliability standards required for space-grade electronics. By re-engineering conventional 200 mm x 200 mm PCB-based electronics into a compact 81 mm x 81 mm SiP module, the company has achieved an 84% reduction in footprint.
The miniaturisation was enabled through the integration of active components in bare-die form on a stacked-substrate configuration using high-density wire bonding, allowing high routing density and multi-function integration within a significantly reduced space—an essential requirement for space-constrained environments.
The module is housed in a fully indigenised custom hermetic ceramic package, designed and manufactured in India. The hermetic solution is engineered to withstand extreme thermal variations and vacuum conditions in space, while also addressing challenges related to signal integrity and thermal dissipation within a compact volume.
The development marks a significant step forward for India’s semiconductor mission and the Make in India initiative, as advanced 3D heterogeneous integration for space electronics is currently limited to a small group of global Tier-1 aerospace players. By developing this capability domestically, izmo Microsystems reduces dependence on restricted foreign technologies for mission-critical applications.
The company said the achievement also lays a sovereign technological foundation for future applications in Silicon Photonics and Quantum Communications, where conventional packaging methods fall short.
Commenting on the milestone, Dinanath Soni, Executive Director of izmo Microsystems Pvt. Ltd., said the successful development validates the company’s technical roadmap and its ability to execute highly complex semiconductor packaging programs. He added that migrating space electronics to integrated 3D architectures is critical for the emerging NewSpace industry, where mass and volume reduction are key performance drivers.